神彩争霸8II下载

Thermal Material

9900 Series thermal conductive pad

Product features

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  • 神彩争霸8ii下载(官方)登录-网站入口/网页版/手机app下载
  • 神彩争霸8ii下载(官方)登录-网站入口/网页版/手机app下载
  • 神彩争霸8ii下载(官方)登录-网站入口/网页版/手机app下载

application:

9900 Series thermal conductive pad widely used in:

Electronic Components: IC, CPU, MOS;

LED, M/B, P/S, Heat Sink, LCD-TV, Notebook PC;

PC, Telecom Device, Wireless Hub etc;

DDR Ⅱ Module/DVD Application/Hand-set Application etc.

Features and advantages:

Ultra Soft and High Compressibility;

5.0 W/m.k Thermal Conductivity;

Low Thermal Impedance;

UL94 V0 Recognized;

Natural Sticky;

EIGENVALUE

KINGBAL 9900 Series thermal conductive pad